DRAM dynamic random access memory chip 512MB 16-bit FBGA-96 H5TQ4G63EFR-RDC

H5TO4G83EFR-XXC,H5T04G63EFR-XXC,H5TO4G83EFR-XXI,H5TO4G63EFR-XXI,H5TQ4G83EFR-xXL,H5TO4G63EFR-XXL,H5T04G83EFR-XX,H5T04G63E FR-XXJ,H5TO4G83EFR-xxK and H5TO4G63EFR-xXK are all 4,294,967,296-bit CMOS dual data rate III (DDR3) synchronous DRAM, which are highly suitable for main memory applications that require high-density memory and high bandwidth. SK Hynix 4Gb DDR3SDRAM offers fully synchronous operation, referring to the rising and falling edges of the clock. All address and control inputs are latched at the rising edge of CK (the falling edge of CK), and Data,Data strobes and Write data masks inputs are sampled at the rising edge and the falling edge. The internal data path adopts a pipeline design and 8-bit prefetching to achieve a very high bandwidth.

Equipment features and ordering information

Characteristics

• VDD=VDDQ=1.5V ± 0.075V

• Fully differential clock input (CK, CK

Differential data selection communication number (DQS, DQS)

Align on-chip DLLS with DQ, DQS, and DQS

Transition

The DM mask writes data to the rising and falling edges of the data selection signal

All address and control inputs (except for data, data selection signal and data mask) are captured at the rising edge of the clock

• Supports programmable CAS delays of 5, 6, 7, 8, 9, 10, 11, 13

And 14

Supports programmable additive delays of 0, CL-1 and CL-2

• Programmable CAS write delay (CWL)= 5, 6, 7, 8

9 and 10

The programmable burst length is 4/8 and it supports half a byte

Sequential and interleaved patterns

The BL switch is in flight

• 8 storage units

"Operation"

)

Through CK conversion

The average refresh cycle (working temperature of 0 oC and 95 oC) to 7.8 (including s in the range of 0 oC and 85 oC 3.9 (including s within 85 oC to 95 oC 1.95 (including s within 85 oC to 95 oC

Commercial temperature (0 ° C to 95 ° C

Industrial temperature (-40 ° C to 95 ° C

Automobile temperature (-40 ° C to 105 ° C

• JEDEC standard 78-ball FBGA(x8), 96-ball FBGA(x16)

• Drive strength selected by EMRS

• Support dynamic on-chip terminals

• Supports asynchronous pin reset

• Supports ZQ calibration

• Supports TDQS(Terminal Data Select Communication Number)(x8 only)

• Supports write levelization

• 8-bit prefetch

Packaging and transportation instructions

- According to the standard export packaging.

Customers can choose from cartons, wooden cases and wooden pallets according to their own requirements.

Q&A

1. How to obtain the price?

We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). If you are in urgent need of a price, please send us an email or contact us in any other way so that we can provide you with a quotation.

2. What is your delivery time?

This depends on the quantity of the order and the season in which you place the order. Usually, we can ship the goods within 7 to 15 days (for small batches), and for large batches, it takes about 30 days.

3. What are your payment terms?

Factory price, 30% deposit, 70%T/T payment before shipment.

4. What is the mode of transportation?

It can be transported by sea, air or express delivery (EMS, UPS, DHL, TNT, FEDEX, etc.). Please confirm with us before placing an order.

5. How do you help our business establish a long-term and good relationship?

We maintain good quality and competitive prices to ensure that our customers benefit.

2. We respect every customer as our friend. We do business with them sincerely and make friends with them, no matter where they come from.