Dynamic Random Access Memory DRAM IndustrialDDR3l DDR3Lx16 2Gb
F60C1A0002-M69W
Device Features
Density: 2G bits
Organization
128Meg x 16 bits
Package
96-ball FBGA
Lead-free (RoHS compliant) and Halogen-free
Power supply
VDDNDDQ =1.35V(1.283 to 1.45V)
Backward compatible DDR3 (1.5V)operation
Data Rate:
04
1600Mbps/1866Mbps
2KB page size (x16)
Row address: A0 to A13
Column address: A0 to A9
Eight internal banks for concurrent operationBurst lengths (BL): 8
and 4 with Burst Chop(BC)
Burst type (BT)Sequential (8, 4 with BC)Interleave (8, 4 with BC)
CAS Latency (CL): 5,6,7,8,9, 10,11,12,13,14
CAS Write Latency(CWL): 5, 6, 7, 8, 9,10Auto precharge option for
each burst accessDriver
strength:RZQ17,RZQ/6(RZQ=240Ω)Refresh:auto-refresh,self-refresh
Average refresh period7.8us at TC ≤ +85°C
3.9us at +85°C ≤TC ≤ +95°C
Operating temperature range
Tc=0°C to +85°C (Commercial Grade)
Te=-40°C to +95°C(Industrial Grade)
The high-speed data transfer is realized bythe 8bits prefetch
pipelined architecture
Double data-rate architecture: two data
transfers per clock cycle
Bi-directional differential data strobe (DQSand DQS#)is
transmitted/received with datafor capturing data at the receiver
DQS is edge-aligned with data for READs;center aligned with data
for WRITEs
Differential clock inputs (CK and CK#)
DLL aligns DQ and DQS transitions with CKtransitionsCommands
entered on each positive CK
edge:data and data mask referenced to bothedges of Das
Data mask(DM) for write data
Posted CAS by programmable additivelatency for better command and
data busefficiencyOn-Die Termination (ODT) for better signa
qualitySynchronous ODTDynamic ODTAsynchronous ODTMulti-Purpose
Register (MPR) for pre-definedpattern read outZQ calibration for DQ
drive and ODT AccessProgrammable partial array self-refresh(PASR)
RESET pin for Power-up sequence and resetfunction
SRT(Self Refresh Temperature) rangeNormal/Extended/ASR
Programmable output driver impedancecontrol
JEDEC compliant DDR3
RH-Free (Row Hammer Free) option is
available
| Product Catalogue | Memory > Dynamic Random Access Memory (DRAM) |
| Universal packaging | FBGA-96 |
| RoHS | Compliance |
| Installation method | Surface mount installation |
| Operating temperature | - 40℃~+95℃ |
| Length * Width * Height | |
| Application grade | Commercial grade |
| Packaging method | pallet |
| Minimum working power supply voltage | 1.35V |
| Organization | |
| Data bus width | |
| Interface type | |
| Storage capacity | 2Gbit |
| Maximum supply current | |
| Maximum working power supply voltage | 1.5V |
Packaging and transportation instructions
- According to the standard export packaging.
Customers can choose from cartons, wooden cases and wooden pallets
according to their own requirements.
Q&A
1. How to obtain the price?
We usually quote within 24 hours after receiving your inquiry
(except weekends and holidays). If you are in urgent need of a
price, please send us an email or contact us in any other way so
that we can provide you with a quotation.
2. What is your delivery time?
This depends on the quantity of the order and the season in which
you place the order. Usually, we can ship the goods within 7 to 15
days (for small batches), and for large batches, it takes about 30
days.
3. What are your payment terms?
Factory price, 30% deposit, 70%T/T payment before shipment.
4. What is the mode of transportation?
It can be transported by sea, air or express delivery (EMS, UPS,
DHL, TNT, FEDEX, etc.). Please confirm with us before placing an
order.
5. How do you help our business establish a long-term and good
relationship?
We maintain good quality and competitive prices to ensure that our
customers benefit.
2. We respect every customer as our friend. We do business with
them sincerely and make friends with them, no matter where they
come from.
