Sign In | Join Free | My himfr.com
Home > DRAM Memory Chip >

FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip

Shenzhen Filetti Technology Co., LTD
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip from wholesalers
     
    Buy cheap FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip from wholesalers
    • Buy cheap FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip from wholesalers
    • Buy cheap FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip from wholesalers
    • Buy cheap FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip from wholesalers

    FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip

    Ask Lasest Price
    Brand Name : FORESEE
    Model Number : FEMDNN008G-08A39
    Certification : ROHS
    Price : consult
    Payment Terms : T/T,Western Union
    Supply Ability : 10000
    Delivery Time : 5-8day
    • Product Details
    • Company Profile

    FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip

    FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip
    Features
    • eMMC5.1 specification compatibility(Backward compatible to eMMC4.41/4.5/5.0)
    • Bus mode
      • Data bus width: 1 bit (default), 4 bits, 8 bits
      • Data transfer rate: up to 400MB/s (HS400)
      • MMC I/F Clock frequency : 0~200MHz
    • Operating voltage range
      • Vcc(NAND) : 2.7 - 3.6V
      • Vccq(Controller) : 1.7 - 1.95V / 2.7 - 3.6V
    • Temperature
      • Operation (-25℃ ~ +85℃)
      • Storage without operation (-40℃ ~ +85℃)
    • Sudden-Power-Loss safeguard
    • Hardware ECC engine
    • Unique firmware backup mechanism
    • Global-wear-leveling
    • Supported features.
      • HS400, HS200
      • Partitioning, RPMB
      • Boot feature, boot partition
      • HW Reset/SW Reset
      • Discard, Trim, Erase, Sanitize
      • Background operations, HPI
      • Enhanced reliable write
      • S.M.A.R.T. Health Report
      • FFU
      • Sleep / awake
    • Others
      • Compliance with the RoHS Directive
    Functional Description

    FORESEE eMMC with powerful L2P (Logical to Physical) NAND Flash management algorithm provides unique functions:

    • Host independence from details of operating NAND flash
    • Internal ECC to correct defect in NAND flash
    • Sudden-Power-Loss safeguard
    Sudden-Power-Loss safeguard

    To prevent from data loss, a mechanism named Sudden-Power-Loss safeguard is added in the eMMC. In the case of sudden power-failure, the eMMC would work properly after power cycling.

    Global-wear-leveling

    To achieve the best stability and device endurance, this eMMC equips the Global Wear Leveling algorithm. It ensures that not only normal area, but also the frequently accessed area, such as FAT, would be programmed and erased evenly.

    IDA(Initial Data Acceleration)

    The eMMC prevents the pre-burned data from data-loss with IDA, in case of our customer had pre-burned data to eMMC, before the eMMC being SMT.

    Cache

    The eMMC enhanced the data written performance with Cache, with which our customer would get more endurance and reliability.

    Partition Management

    The embedded device offers also the possibility of configuring by the host additional split local memory partitions with independent addressable space starting from logical address 0x00000000 for different usage models. Default size of each Boot Area Partition is 4096 KB and can be changed by Vendor Command as multiple of 128KB. Boot area partition size is calculated as ( 128KB * BOOT_SIZE_MULTI ) The size of Boot Area Partition 1 and 2 cannot be set independently and is set as same value Boot area partition which is enhanced partition. Therefore memory block area scan is classified as follows:

    • Factory configuration supplies boot partitions.
    • The RPMB partition is 4MB.
    • The host is free to configure one segment in the User Data Area to be implemented as enhanced storage media, and to specify its starting location and size in terms of Write Protect Groups. The attributes of this Enhanced User Data Area can be programmed only once during the device life-cycle (one-time programmable).
    • Up to four General Purpose Area Partitions can be configured to store user data or sensitive data, or for other host usage models. The size of these partitions is a multiple of the write protect group. Size and attributes can be programmed once in device life-cycle (one-time programmable). Each of the General Purpose Area Partitions can be implemented with enhanced technological features.
    Pin Descriptions
    CLOCK(CLK)
    Each cycle of the clock directs a transfer on the command line and on the datalines.
    COMMAND(CMD)
    This signal is a bidirectional command channel used for device initialization and command transfer. The CMD Signal has 2 operation modes: open drain, for initialization, and push-pull, for command transfer. Commands are sent from the host to the device, and responses are sent from the device to the host.
    DATA(DAT0-DAT7)
    These are bidirectional data signal. The DAT signals operate in push-pull mode. By default, after power-up or RESET, only DAT0 is used for data transfer. The controller can configure a wider data bus for data transfer wither using DAT[3:0](4bit mode)or DAT[7:0](8bit mode). Includes internal pull-up resistors for data lines DAT[7:1]. Immediately after entering the 4-bit mode, the device disconnects the internal pull-up resistors on the DAT1 and DAT2 lines.(The DAT3 line internal pull-up is left connected.) Upon entering the 8bit mode, the device disconnects the internal pull-up on the DAT1, DAT2, and DAT[7:4]lines.
    Data Strobe(DS)
    Newly assigned pin for HS400 mode. Data Strobe is generated from e.MMC to host. In HS400 mode, read data and CRC response are synchronized with Data Strobe.
    RESET(RSTN)
    Hardware Reset Input
    Vccq
    Vccq is the power supply line for host interface, have two power mode: High power mode:2.7V~3.6V; Lower power mode:1.7V~1.95V
    Vcc
    Vcc is the power supply line for internal flash memory, its power voltage range is:2.7V~3.6V
    VDDi
    VDDi is internal power node, not the power supply. Connect 1uF capacitor VDDi to ground
    Vss,Vssq
    Ground lines
    Packaging & Shipping

    Standard export packaging available. Customers can choose from cartons, wooden cases, and wooden pallets according to their requirements.

    Frequently Asked Questions

    How to obtain the price?

    We typically provide quotations within 24 hours of receiving your inquiry (excluding weekends and holidays). For urgent pricing requests, please contact us directly.

    What is your delivery time?

    Small batches typically ship within 7-15 days, while large batch orders may require approximately 30 days depending on order quantity and season.

    What are your payment terms?

    Factory pricing with 30% deposit and 70% balance payment via T/T before shipment.

    What are the shipping options?

    Available shipping methods include sea freight, air freight, and express delivery (EMS, UPS, DHL, TNT, FEDEX). Please confirm your preferred method before ordering.

    Quality FEMDNN008G-08A39 BGA-153 8G EMMC Flash Memory Chip for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Filetti Technology Co., LTD
    *Subject:
    *Message:
    Characters Remaining: (0/3000)